项目 |
内容 |
常规 |
特殊 |
1 |
层数
NO.OF LAYER |
1 ～ 5 层 |
6 层 |
2 |
完成板尺寸 ( 最大 )
FINISHED BOARD SIAE (MAX) |
250*500mm |
|
3 |
完成板尺寸 ( 最小 )
FINISHED BOARD SIAE (MIN) |
10mm*15mm |
|
4 |
板厚度 ( 最大 )
BOARD THICKNESS (MAX) |
16 mil (0.4mm) |
|
5 |
板厚度 ( 最小 )
BOARD THICKNESS (MIN) |
3 mil (0.075mm) |
|
6 |
成品厚度公差 ( 0.085mm ≦板厚 < 0.4mm)
FINESHED BOARD THICKNESS FOLERANCE
(0.085MM ≦ BOARD THICKNESS< 0.4mm) |
± 2mil( ± 0.05mm ) |
± 0.03mm |
7 |
钻孔孔径 ( 最大 )
DRILL HOLE DIAMETER (MAX) |
240 mil (6.0mm) |
6.5mm |
8 |
钻孔孔径 ( 最小 )
DRILL HOLE DIAMETER (MIN) |
8 mil (0.2mm) |
0.15mm |
9 |
外形精度 |
± 0.1mm |
± 0.05mm |
10 |
完成孔径 ( 最小 ) For machine drill
FINESHED VIA DIAMETER (MIN) |
6 mil (0.15mm) |
0.10mm |
11 |
底铜厚度 ( 最小 )
OUTER LAYER BASE COPPER THICKNESS (MIN) |
1/2OZ(18um) |
1/3OZ |
12 |
底铜厚度 ( 最大 )
OUTER LAYER BASE COPPER THICKNESS (MAX) |
2OZ(70um) |
3OZ |
13 |
材料类型
BASE.MATERIAL |
PI 聚酰亚胺 /PET 聚脂 |
无胶基材 |
14 |
孔径公差 ( 镀通孔 )
HOLE DIAMETER TOLERANCE (PTH) |
± 3mil( ± 0.075 mm ) |
|
15 |
钻孔孔径公差 ( 非镀通孔 )
HOLE DIAMETER TOLERANCG (NPTH) |
± 2mil( ± 0.050mm ) |
|
16 |
设计线宽 / 间距 ( 最小 )
LAVER DESIGN LINE WIDTH/SPACING (MIN) |
0.06mm/0.06mm |
2mil
(0.05/0.05mm) |
17 |
蚀刻公差 TOLERANCE AFTER ETCHING |
≦ ± 20%( 一般 ) |
± 15% |
18 |
图形对图形精度 ( 最小 )
IMAGE TO IMAGE TOLERANCE (MIN) |
± 4mil( ± 0.1mm ) |
± 3mil
(0.076mm) |
19 |
CVL 对位精度贴合公差 CVL REGISTRATION(MIN) |
± 8mil ( ± 0.2MM ) |
± 0.15MM |
20 |
CVL 压合溢胶量 (MIN) |
≦ 4mil (0.1MM) |
OK |
21 |
金手指镀金厚度及公差 (plating)
GOLD FINGER AU THICKNESS (MAX) TOLEARANCE THICKNESS |
(0.01-0.03UM) (0.03-0.05UM) |
厚金 1-2UM |
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